Case study - Nokia & Kurtz Ersa
Case study
Nokia & Kurtz Ersa: an ESD-safe tool for PCB repair
Espoo, Finland · Telecommunications · P3 DLP (Loctite 3D IND3380 ESD)
To extend product lifecycles, Nokia repairs and refurbishes PCBs. Together with Kurtz Ersa and Henkel, it developed a processing tool for safe, repeatable repairs.
The challenge
Many components are highly integrated and sensitive to heat. Local desoldering with an IR heat source can damage nearby parts. Nokia needed a standard, scalable solution that also protects against electrostatic discharge.
The solution
The tool combines metal with a 3D printed ESD-safe body in Loctite 3D IND3380 ESD, made to fit Nokia’s board layouts. The material has a heat deflection temperature of 190 °C (ASTM D648, 0.455 MPa).
The body adapts easily to new boards. When extra cooling is needed, simple changes do the job.
The results
- Less thermal stress on components and PCBs
- Reliable ESD protection
- Consistent, regulation-compliant repairs
- Layout data can be reused, which makes automation easier
Application: ESD jigs & fixtures
ESD-safe tools for handling sensitive electronics, in materials such as Loctite 3D IND3380 ESD (P3) or ABS-ESD7 (FDM).
Source: Stratasys Application Guide and Stratasys case material. Photo: Stratasys.
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